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Topics include advanced heterogeneous packaging for FHE, stretchable electronics, electronics environmental sustainability and more.
June 11, 2020
By: Anthony Locicero
Copy editor, New York Post
SEMI FlexTech released a Request for Proposals (RFP) for advanced technology developments of flexible hybrid electronics (FHE) for sensors, power and other key electronic components. Product demonstrations are required for award consideration. The RFP topics include: Power and power integration; Reliability; Electronics environmental sustainability; Advanced heterogeneous packaging for FHE; Materials advances; Soft robotics; Stretchable electronics ...
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